BB-801 400 Tie Point Solderless Breadboard Circuit Gadget
Description:
This is a solderless breadboard with 400 tie points. It has a standard double-strip in the middle and two power rails on both sides.
Main Features:
● Wire size: Suit for 29-20 AWG wire
● Metal contact clips are available.
● Ideal for Arduino shield prototyping and testing.
Specifications
General
Type: Solderless Breadboard
Model: BB-801
Compatibility: Ardunio
Weight and Size
Product weight: 0.038 kg
Package weight: 0.068 kg
Product Size(L x W x H): 8.300 x 5.400 x 1.000 cm / 3.268 x 2.126 x 0.394 inches
Package Size(L x W x H): 14.000 x 7.500 x 1.500 cm / 5.512 x 2.953 x 0.591 inches
Package Contents
Package Contents: 1 x BB-801 400 Tie Point Solderless Breadboard