This thermal silica film has good thermal conductivity and insulation properties.
Filling the between the heat sink and power device,
Alternative ideal thermal grease thermal paste plus mica (insulation material) dual cooling system.
Dimensions: 100mm * 100mm * 1mm
（You can acorde to your needs, cut it into the desired size）
Color: Gray white
Thermal conductivity: Thermal conductivity 2.0W / m.k

Application:
Heating power devices for electronic products, electronic equipment
(Integrated circuits, power management, SCR, transformers, etc.)
Close contact between the cooling facilities (heat sink, aluminum, etc.) and to achieve better thermal effects.
GPU, graphics card, memory, north and south bridge chip, memory chipset, IC LED LCD and so on.

Package includes: 1xThermal pad