This module is built from an eight-layer PCB and highly-screened memory ICs. The efficient heat spreader provides effective cooling to improve overclocking potential.
This is optimized for performance on the latest 3rd and 4th generation Intel Core platforms. XMP 1.3 profile support makes stable overclocking easy and automatic.
Density: 16GB (2x8GB), Speed: 1600MHz, Format: DIMM
Tested Latency: 9-9-9-24, Voltage: 1.5V, Heatspreader: Anodized Aluminum

Technical Details

Product Details

Product Dimensions

Package Dimensions
Width : 4.72 inch
Height : 0.24 inch
Length : 6.06 inch

Item Weight: 1.76 ounce (View shipping rates and policies)
Shipping Weight: 2.88 ounce (View shipping rates and policies)

ASIN : B00D5XAN06