blade ultra-thin,high toughness, high temperature, no deformation, no sticky tin, you can quickly separate the tin point.

Applicable to repair the Apple motherboard tool demolition CPU dismantling chip
1. The thickness of the blade is thinner than that of the tin, so it can work well between the chip and the bottom of

the plate.
2: demolition of a variety of small chips will not drop points
3: split 6S power IC various glass IC, do not hurt the glass, will not drop, no risk
4: split base with CPU WIFI module, no risk will not drop points
5: Remove the A4-A9 CPU without risk, demolition of all the upper CPU is no risk
6: thicker scraper, scraping the CPU once, no need to repeat the scraping

*The difference between the blade and the tweezers is that the blade tweezers can not be placed under the chip,so the blade is better than  the tweezers

How to use
1: remove the chip first clean the position of the edge of the knife and the glue around the chip temperature 200
2: hot air gun opened to 150 degrees, the wind speed of the mouth of the board for 60 minutes preheat treatment for 2 minutes
3: hot air gun on the small head, the temperature of 350 degrees to open the first knife position for about 10 seconds and then

shake to the bottom of the chip to insert.
Note: when the knife is not inserted into the left and right side of the note that there is no melting point of tin melt very easily after the knife can be inserted