COOL-GELFILM SZ is an enhanced thermal gap-filling material that provides extreme thermal conductivity and thus unparalleled thermal interface resistance for board level multiple component thermal management.
COOL-GELFILM SZ is designed to provide conformability and compressibility to bridge the thermal gap of large boards and sensitive components.
COOL-GELFILM SZ is non-silicone and thus will not contaminate components.

Technical Details

Product Details

Product Dimensions

Package Dimensions
Width : 4 inch
Height : 0.75 inch
Length : 7.5 inch

Item Weight: 0 ounce (View shipping rates and policies)
Shipping Weight: 0.96 ounce (View shipping rates and policies)

ASIN : B00RH1QS6U