Highlights

• JEDEC Standard
• DDR3 Speed Grade : 1333Mbps
• Unbuffered DIMM : 240-pin
• Memory Organization : x8 FBGA DRAM chip
• DDR3 DRAM interface : SSTL_15
• CAS latency : 9-9-9
• Bandwidth : 10660MB/s
• VDD voltage : 1.5+-0.075V
• VDDQ voltage : 1.5+-0.075V
• Standard OP Temp.: 0℃~+85℃
• Industrial OP Temp.:-40℃~+85℃
• Serial presence detect with EEPROM.
• PCB height : 1.18 inch
• RoHS Compliant
• Application : Desktop

Overview

The Module is DDR3-1333 CL9 Unbuffered Memory module. The Module density from 1GB to 4GB, it consists 64/128MX8 bit DDR3-1333 Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 240-pin edge connector sockets. The electrical and mechanical specifications are as follows.

Specification

Photo
Product Name	DDR3-1066	DDR3-1333	DDR3-1066 VLP	DDR3-1333 VLP
Capacity	1G/2G/4G	1G/2G/4G	1G/2G/4G	1G/2G/4G
Memory Architecture	x8 DRAM chip	x8 DRAM chip	x8 DRAM chip	x8 DRAM chip
Voltage	1.5+-0.075V	1.5+-0.075V	1.5+-0.075V	1.5+-0.075V
PIN	240-pin	240-pin	240-pin	240-pin
Cas Latency	CL7	CL9	CL7	CL9
Standard OP Temp(℃)	0~+85	0~+85	0~+85	0~+85
Industrial OP Temp(℃)	-40~+85	-40~+85		-
JEDEC Standard	Yes	Yes	Yes	Yes
RoHS Compliant	Yes	Yes	Yes	Yes
Warranty	Limited Product Lifetime	Limited Product Lifetime	Limited Product Lifetime	Limited Product Lifetime