Breaking Design MoldsEfficiency by InnovationCRYORIG H Series coolers feature our proprietary Hive Fin・structure. This design allows for a combination of Jet Fin Acceleration・and Turbulence Reduction, as well as strengthening structural strength of the fin stacks. Combined together, the Hive Fin・design brings cool innovation.Air Exhaust AccelerationHot Air Cooled FastBy utilizing a larger air intake and narrower air exhaust section on the fins, compresses the air to move faster while exiting the heatsink. Jet Fin Acceleration System・carries the hot air out of the system faster and more efficiently.Extreme EfficiencyTurbulence Reduction SystemUtilizing a bee hive shaped structure at the front air intake of the heatsink, lowers air turbulence and straightens out the airflow. Assisting airflow to move directly through the full length of the heatsink and carrying out hot air.OptimizedHeatpipe PositioningTotal CPU CoverageThe H7痴 Heatpipe Convex-Align・System allows for more heatpipes in a given area, optimized heatpipe placement in the copper base, and improved alignment with your CPU. With the Heatpipe Convex-Align・System, each heatpipe functions to their maximum TDP capacity.Extra AirExtra PerformanceQuad Air Inlet・CRYORIG痴 proprietary Quad Air Inlet・system features four strategically placed aerodynamic air inlet that allows for extra air intake. The additional air intake allows the QF series fan to have a higher air output volume for its fan diameter, which equals better temperatures for your CPU heatsink and more air exchanged for your system case.Unmatched CompatibilityZero RAM InterferenceFocusing on providing the widest range ofcompatibility, the H7 utilizes an asymmetric slantedheatpipe layout to move the heatsink away from theRAM zone, Offering optimal compatibility for RAMwith tall heat spreaders on both Intel・115X andAMD platforms.Patent Pending X-Bar・Quick Mount SystemFast, Easy and SecureOur new patent pending X-Bar・Quick Mount System follows CRYORIG痴 renowned mounting system design, and provides a quick and secure solution on both Intel・and AMD platforms. The X-Bar・system痴 dedicated backplate is made from fiber glass augmented PBT, for higher tensile strength, resistance to heat and is more easily recyclable than other plastics. The backplate protects the mainboard from excessive stress that may come from the mounted heatsink, and also provides a solid base for your fast and secure installation.