PRODUCT NAME
MG Chemicals Black Flexible Epoxy Encapsulating and Potting Compound, 1.7 L, 2-Part Kit,
PRODUCT CODE: PROD3030149327
PRODUCT INFORMATION
Flexible and high durability
Mix ratio 1A: 1B compatible with most dispensing equipment
Resistance to water and humidity
Protects electronics from moisture, corrosion, fungus, thermal shock, and static discharges
Flow able and free of solvent parts
Technical Details
Product Details
Product Dimensions
Package Dimensions
Width : 5.51 inch
Height : 5 inch
Length : 13.9 inch
Item Weight: 0 ounce (View shipping rates and policies)
Shipping Weight: 0 ounce (View shipping rates and policies)
ASIN : B0716JFBN4
Product Description
The 832Fx black flexible epoxy encapsulating and potting compound is an economical, electronic-grade, two-part system that is flow able. Its cured form is flexible offering excellent physical, chemical, and electrical protection, and providing some small amount of thermal conductivity. It protects against static discharges, thermal shocks, vibrations, and mechanical impacts. It is extremely resistant to environmental humidity, salt water, and harsh chemicals. It also hides and restrict access to Intellectual property by being much harder to remove than standard epoxy encapsulating compounds. Applications & usages the 832Fx flexible epoxy is used to pot or encapsulate printed circuit assemblies in a protective block. The cured epoxy improves reliability, operational range, and lengthens the life of electrical and electronic parts. Attention! If the parts have crystallized, pre-heat at 50 °C [122 °F] until fully re-liquefied. Let cool to room temperature before use.