EGC High-Performance Thermal Paste Compound for CPU Heatsinks - 4 Grams
[Product Information]
- High-performance thermal compound maximizes thermal conductivity
- Easy to apply with the included application-stick
- Thermal conductivity: > 5.15 W/mk
- Perfect for enthusiasts and system-builders looking looking for optimal cooling
- 45% Matal Oxide Compounds / 45% Carbon Compounds / 10% Silicone Compounds
