Raspberry Pie Overclocking Three Small Goldfish Fin Memory memory Fin three North and South Bridge<br /><br />Using purpose: memory grain cooling or other suitable cooling purposes.<br />Steps: 1， check the chip size， determine the size of not less than the product<br />2， remove the oil on the surface of the chip<br />3， remove the membrane attached at the bottom of the product<br />4， the product in the center of the wafer<br />5， 1 to 2 minutes， press the fin heat sink and chip bonding is good<br />After 6， move or vibration machine， please check whether the heat sink is complete on the wafer<br />Use note: 1， this product is designed for memory particles radiator， if you need for other cooling purposes， please make your own to determine whether a good size.<br />2， please send IC surface stains and dust， clean up the oil used again， otherwise it may not firm.<br />3， this product is a conductive metal， when installation， please do not come into contact with the surrounding components<br />4， purchase and install the product， please make sure the product chip you are using is not less than this product<br />After 5， movement or vibration machine， please check whether the heat sink is complete on the wafer<br /><img src="http://img6.eachbuyer.com/x9/p100/eb9604_1.jpg" />                                                        <img src="http://img6.eachbuyer.com/x9/p100/eb9604_2.jpg" />                                                        <img src="http://img6.eachbuyer.com/x9/p100/eb9604_3.jpg" />