Epoxy mold release
Non-Silicone
It allows for a clean removal of the cured epoxy
For use with all types of epoxies and phenolic resins

Technical Details

Product Details

Package Dimensions
Width : 2.68 inch
Height : 2.68 inch
Length : 9.45 inch

Shipping Weight: 1.06 pounds (View shipping rates and policies)

ASIN : B005T6GTGO

Product Description

Epoxy mold release apply to a surface before pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use with all types of epoxies and phenolic resins. RoHS compliant.