Intel Thermal Solution Cooling Fan/Heatsink for LGA2011 E5-2600 Processors (BXSTS200C)
[Product Information]
- Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink with fan removed
- 2U or larger rack chassis with ducted airflow to heat sink
- Pedestal chassis with ducted airflow to heat sink
- Max CPU TDP 130W
- Compatible Socket: LGA2011
