Formula is ideal for potting and bonding electronic and electrical components
Non-exothermic reaction safeguards heat-sensitive components
Extended work-time allows for positioning and adjustment to fit prior to setting
Non-corrosiveness to copper preserves conductivity and retention of insulation properties
Effective adhesive system for potting, bonding, joining, gluing, attaching, assembling, encapsulating, and sealing applications

Technical Details

Product Details

Product Dimensions

Package Dimensions
Width : 1.5 inch
Height : 0.6 inch
Length : 3.7 inch

Item Weight: 0 ounce (View shipping rates and policies)
Shipping Weight: 2.4 ounce (View shipping rates and policies)

ASIN : B000X5G6O6