Removes QFP''s, PLCC''s, SOIC''s, and chip components under 300 degrees Fahrenheit

Technical Details

Product Details

Product Dimensions

Package Dimensions
Width : 2.6 inch
Height : 0.7 inch
Length : 3.7 inch

Item Weight: 1.6 ounce (View shipping rates and policies)
Shipping Weight: 1.6 ounce (View shipping rates and policies)

ASIN : B0019UZP7I

Product Description

This Kit makes de-soldering Super fast and easy. Through-hole and surface mount components will come out with ease, and without any wick at all! no more mess and no potential damage to printed circuit boards.